Package: kmod-hwmon-w83793
Version: 4.4.194-1
Depends: kernel (=4.4.194-1-c65d98a6dfa1d5961af8bda101022bbb), kmod-hwmon-core, kmod-i2c-core, kmod-hwmon-vid
Source: package/kernel/linux
License: GPLv2
Section: kernel
Architecture: arm_xscale
Installed-Size: 13632
Description:  Kernel module for the Winbond W83793G and W83793R chips.
