Package: kmod-hwmon-w83793
Version: 4.14.128-1
Depends: kernel (=4.14.128-1-ceee94fd0f82b0c356713289c5678fc0), kmod-hwmon-core, kmod-i2c-core, kmod-hwmon-vid
Source: package/kernel/linux
License: GPL-2.0
Section: kernel
Architecture: arm_xscale
Installed-Size: 13644
Description:  Kernel module for the Winbond W83793G and W83793R chips.
