Package: kmod-hwmon-w83793
Version: 4.4.89-1
Depends: kernel (=4.4.89-1-581a5e1d4c991abb6b43ad8a3e8abca3), kmod-hwmon-core, kmod-i2c-core, kmod-hwmon-vid
Source: package/kernel/linux
License: GPLv2
Section: kernel
Architecture: arc_arc700
Installed-Size: 18205
Description:  Kernel module for the Winbond W83793G and W83793R chips.
