Package: kmod-hwmon-w83793
Version: 4.4.182-1
Depends: kernel (=4.4.182-1-7b5dd03b6bc67f06a56b0409155f7b22), kmod-hwmon-core, kmod-i2c-core, kmod-hwmon-vid
Source: package/kernel/linux
License: GPLv2
Section: kernel
Architecture: mipsel_24kc
Installed-Size: 14280
Description:  Kernel module for the Winbond W83793G and W83793R chips.
